Contrary to traditional plating methods, nickel silicon carbide (CODIAC) utilizes microscopic particles of silicon carbide suspended within an electroless nickel matrix comprised of 90-93% nickel and 7-10% phosphorous for better protection against wear and corrosion, cutting maintenance costs by eliminating costly replacement parts costs as well as reduced machine shutdown time. It protects substrates from extreme wear and corrosion protection while significantly decreasing maintenance costs with decreased replacement part costs and downtime associated with machine shutdown.
Chemical Vapor Deposition (CVD)
CVD (chemical vapour deposition) is a chemical process for creating thin films. This involves mixing liquid carrier gas and vapor precursor into nanometer-sized particle clusters which then deposit on substrate surfaces through heat and plasma energy, hardening into hard, durable coatings with complex geometries such as spheres, cones or tapered surfaces. CVD offers many advantages when producing dense thin films; for instance it can create dense uniform thin films of any density on complex geometry such as spheres conical surfaces tapered surfaces – an advantage over many chemical processes utilised by conventional coating methods.
CVD stands out from PVD by requiring less energy, cutting both costs of materials and power consumption of equipment. CVD uses various precursors such as organometallic compounds (e.g. TEOS and trimethylphosphate) and halides such as dichloro- and trichlorosilane for production; solid materials like aluminum alkyls, titanium nitride, tungsten hexafluoride and tantalum pentachloride can all be utilized. It can also deposit high purity nitrides/carbide materials made of metal oxides/polymers!
CVD processes come in various varieties, each with their own set of unique characteristics. Many CVD processes can be distinguished by how precursor gases are introduced into the reaction chamber: either at atmospheric pressure, low-pressure or ultrahigh vacuum conditions – this can influence thickness and uniformity of films deposited from them.
Other CVD processes include rapid thermal CVD (RTCVD), which uses heating lamps to rapidly heat spots or lines on semiconductor substrates; plasma enhanced CVD or PECVD uses radiofrequency or direct current discharge ionization of precursor gases to speed up reaction times and enhance film quality; and photo-initiated CVD which uses UV and IR light sources as initiating agents for chemical reactions.
SilcoTek’s experienced process technologists can assist with selecting an optimal CVD process to meet the demands of your application, and our state-of-the-art facilities offer us an ideal environment to help optimize manufacturing operations while providing better performance, value and coating quality. Reach out now to find out more.
Physical Vapor Deposition (PVD)
PVD (Physical Vapor Deposition) is an inorganic material deposition process in which solids are vaporized under vacuum before depositing them on substrates, producing pure materials and alloy compositions such as carbon, titanium nitride and diamondlike carbon (DLC).
Physical Vapor Deposition can produce high-quality films compared to CVD, yet it must be remembered that each method has its own set of advantages and disadvantages. Physical vapor deposition requires high levels of control to reach desired thickness levels with precise methods for monitoring and adjusting process as well as impactful type of vaporization that will shape structure of thin film produced.
Physical Vapor Deposition techniques most frequently employed are sputtering and thermal evaporation. Sputtering uses DC or RF energy beams to bombard target materials and their constituent atoms, forcing them back onto substrate surfaces as sputtered layers that range in thickness from nanometers to several millimeters – an efficient and versatile technique well suited to high precision applications.
Thermal evaporation is another popular physical vapor deposition method, though it tends to be slower and more expensive than sputtering. A hot electric arc evaporates parts of target material before it’s deposited onto substrate – making this approach ideal for larger-scale or industrial production due to potential savings over sputtering.
TiN, CrN and DLC coatings are among the most frequently applied PVD coatings. These typically cover metals like steel and aluminum as well as ceramics and plastics; offering properties ranging from corrosion resistance and hardness to wear resistance and durability. Not only are high-performance coatings cost-effective and environmentally-friendly, they’re also easy to apply over complex geometries and structures without using solvents or chemical agents that corrode, making application effortless. PVD coatings are frequently found on high-performance aerospace and automotive components. Their ability to withstand extreme temperatures and abrasion make them the ideal choice for high-speed machinery; additionally, PVD coatings make for durable medical devices that must remain reliable over time.
Thermal Spray
Thermal spray coating is a widely employed process for improving surface properties, which entails depositing fine, semi-molten metal particles onto substrate materials with the aim of creating surfaces with unique physical characteristics. Sprayed materials could include pure metal as well as various alloys, ceramics, carbides or composites containing these particles.
Sprayed metal particles are heated to a molten state using electrical energy or plasma and propelled onto a substrate at high velocity with gas or compressed air streams. Controlling both temperature and speed is key to this process as both will have an impactful impact on the quality of coating produced.
Metal spraying provides a diverse selection of coatings for applications in power generation, aerospace and general industrial sectors. These coatings protect equipment parts and sections against corrosion and erosion for new or refurbished units as well as reduce the risk of metal loss caused by erosion and corrosion at power plants.
Metal spraying presents some potential concerns regarding air emissions from its process, as these emissions could contain metal particles which have health impacts for those exposed. California Air Resources Board is currently exploring whether additional controls must be put in place in order to ensure public health protection during metal spraying operations.
As well as thermal spray processes, cold and arc spray techniques may also be utilized. While cold sprays are capable of spraying many materials, they tend to be less reliable for spraying harder or brittle materials due to compressive residual stresses that could potentially result in cracks being formed in their coating application.
Due to this factor, most thermal spray coatings are usually applied using an arc or plasma process with an additional step of fusing substrate and material together, creating a metallurgical bond instead of an adhesive one and producing stronger, more durable coatings without pores or porosities.
Electroless Plating
Electroless plating is a non-electrical process used to coat both conductive and non-conductive materials. It’s ideal for making components tougher, more resistant to friction and corrosion, more aesthetically appealing and tougher; but electroplating remains more effective at producing thick layers of metal.
Electroless plating relies on chemical reactions and reduction of metal complex ions rather than electrical current, rather than simply coating objects with metal plating solution. When metal ions come into contact with substrate, they will be oxidized by complexing agents or stabilizers in electroless plating solution, providing electrons to desired metal cations so it can be reduced via specific compounds found within electroless plating solution.
Electroless plating processes can take time to complete due to pretreatments like sensitization and activation that must occur before proceeding with electroless plating – this may also cause flaking or peeling on surfaces covered in coating.
Electroless plating requires many chemicals that can be expensive and wasteful to purchase and dispose of; additionally, many of them contain harmful toxins which could endanger humans as well as harm the environment.
Even with its drawbacks, electroless plating remains popular within manufacturing industries. It provides numerous advantages such as being compatible with both conductive and non-conductive surfaces as well as producing thicker metal layers than electroplating can produce. Unfortunately, however, electroless plating lacks versatility compared to its rivals; so this technique may best suit situations in which thickness concerns are less of an issue.
If you’re in search of ways to protect the electrical components in your home, these three methods offer great starting points. With them, you can ensure the safety and durability of each component in the future. Alternatively, copper or nickel alloy plating options available from Gateway Cable Company might also prove effective.